Side By Side Prototype Breadboard - 750 Tie Points

These 750 tie-point side-by-side breadboards offer a great value large solderless prototyping platform. They are big and versatile enough for the most demanding of projects. Components and wire can be inserted into the board for testing without the need for solder. Multiple breadboards can be interconnected and the boards measure 99mm x 82.7mm x 8.3mm and feature a self-adhesive backing.

The breadboard features two terminal strips with 600 tie-points, three power distribution strips with 150 tie-points, and has a standard pitch spacing of 2.54mm. More detailed technical information can be found in the Datasheet.

Features:
750 tie-point side-by-side breadboards offer a great value large solderless prototyping platform.
Multiple breadboards can be interconnected.
The breadboard features two terminal strips with 600 tie-points and three power distribution strips with 150 tie-points.
They have a standard pitch spacing of 2.54mm.
Wire Range: 29AWG to 20AWG.
These breadboards feature a self-adhesive backing.
The boards measure 99mm x 82.7mm x 8.3mm.